Tuesday, February 21, 2012

Wire Bonding in Altium Designer


Have you ever considered the use of a wire bonded chip on your PCB? Several advantages exist including the

ability to reduce the height of the product package; the ability to hide the chip to make reverse engineering difficult;

the need to reduce material cost and turn time for high volume production; and the possibility to increase the speed

of the overall design by removing a connection point between the PCB, package, and chip.

Altium Designer has the ability to handle the wire bonding using existing capabilities within the tool. This is made

possible by using a signal layer in the PCB to represent the die and its connectivity, while making use of the jumper

option in the property of the pads primitive. This application note will provide specifics on how to create the library

footprint, and how to implement it on the PCB.



You can read the full article here.

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